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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6422 Issued Date : 1992.11.25 Revised Date : 2001.06.15 Page No. : 1/3 HBC556 PNP EPITAXIAL PLANAR TRANSISTOR Description The HBC556 is primarily intended for use in driver stage of audio amplifiers. Features * High Breakdown Voltage: 65V at IC=1mA * High AC Current Gain: 75-500 at IC=2mA,VCE=5V,f=1MHz Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 500 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -80 V VCEO Collector to Emitter Voltage .................................................................................... -65 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ..................................................................................................... -100 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO VBE(on)1 VBE(on)2 *VCE(sat)1 *VCE(sat)2 *hFE fT Cob Min. -80 -65 -5 -600 75 Typ. 300 4.5 Max. -15 -750 -820 -300 -650 475 Unit V V V nA mV mV mV mV MHZ Pf Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-30V, IE=0 IC=-2mA, VCE=-5V IC=-10mA, VCE=-5V IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA VCE=-5V, IC=-2mA, VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, IE=0, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification of hFE Rank Range A 125-250 B 220-475 Normal 75-475 HBC556 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100000 Spec. No. : HE6422 Issued Date : 1992.11.25 Revised Date : 2001.06.15 Page No. : 2/3 Saturation Voltage & Collector Current 100 hFE @ VCE=5V Saturation Voltage (mV) 10000 hFE 1000 VBE(sat) @ IC=20IB 100 VCE(sat) @ IC=20IB 10 1 0.1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 10 Capacitance & Reverse-Biased Voltage 1000 Capacitance (pF) On Voltage (mV) Cob VBE(on) @ VCE=5V 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current (mA) Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10000 PT=1ms Safe Operating Area PT=100ms Collector Current-IC (mA) Cutoff Frequency (MHz) 1000 PT=1s 100 VCE=5V 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HBC556 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6422 Issued Date : 1992.11.25 Revised Date : 2001.06.15 Page No. : 3/3 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Collector 2.Base 3.Emitter 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HBC556 HSMC Product Specification |
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